Power Module Packaging Market Analysis, Growth, Survey Report 2032 | Emergen Research

 The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.

The Global Power Module Packaging Market report provides full coverage of the companies’ data, including details about their production and manufacturing capacity, product portfolio, business overview, revenue, gross profit margins, sales network and distribution channel, financial standing, and market position. The report also studies business strategies and strategic alliances undertaken by companies to gain a robust footing in the market. The report sheds light on the mergers and acquisitions, collaborations, joint ventures, brand promotions and product launches, agreements and partnerships, and corporate and government deals. The comprehensive analysis of the competitive landscape offers the readers a deeper understanding about the competitors.

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The global Power Module Packaging market report discusses in detail the revenue and cost profit analysis of the prominent players of the market. It also focuses on the strategic initiatives taken by the companies to gain a robust footing in the market such as mergers and acquisitions, collaborations, joint ventures, partnerships, corporate and government deals, and licensing agreements, among others. It covers business overview, expansion plans, gross profit margins, revenue growth, production and manufacturing capacity, product portfolio, and financial standing of the companies. SWOT analysis and Porter’s Five Forces analysis are also covered to offer detailed analysis of the key companies operating in the market.

Top Key Players :

SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc

Covid 19 Analysis :

The report is updated with the latest economic scenario and market scope with regard to the ongoing COVID-19 pandemic. The report covers growth prospects as well as current and futuristic revenue estimations in a post COVID scenario. The report also covers changing trends and market dynamics due to the pandemic and provides an accurate impact analysis of the crisis on the overall market. The report clearly defines the Power Module Packaging market position on a global level. The detailed insights into the market’s geographical spectrum offered by the report make it an excellent source of knowledge about the Power Module Packaging industry.

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  • Power Module Type Outlook (Revenue, USD Billion; 2019-2032)

    • Silicon Carbide (SiC) Module
    • Gallium Nitride (GaN) Module
    • Insulated-Gate Bipolar Transistor (IGBT) Module
    • Field-Effect Transistor (FET) Module
    • Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
    • Others

  • Technology Outlook (Revenue, USD Billion; 2019-2032)

    • Standard Packaging
    • Advanced Packaging
    • Pressure-Contact Modules
    • Others

  • Thermal type Outlook (Revenue, USD Billion; 2019-2032)

    • Liquid-Cooled
    • Air-Cooled
    • Hybrid

Geographically, this report studies the key regions, focuses on product sales, value, market share and growth opportunity in these regions, covering:

  • United States
  • Europe
  • China
  • Japan
  • Southeast Asia
  • India

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Table of content

Chapter 1: Methodology & Scope

  • Definition and forecast parameters
  • Methodology and forecast parameters
  • Data Sources

Chapter 2:

Executive Summary

  • Business trends
  • Regional trends
  • Product trends
  • End-use trends

Chapter 3:

Industry Insights

  • Industry segmentation
  • Industry landscape
  • Vendor matrix
  • Technological and innovation landscape

Chapter 4:

Regional Landscape

Chapter 5:

Company Profile

  • Business Overview
  • Financial Data
  • Product Landscape
  • Strategic Outlook

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  8. Potential Market Opportunities
  9. Growth Dynamics
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TOC of the global Power Module Packaging Market report:

Chapter 1, describes the Power Module Packaging Market  Introduction, market overview, product offerings, growth opportunities, market risks, driving forces, and challenges.

Chapter 2, analyzes the key manufacturers of Power Module Packaging Market , along with the sales, revenue, and price of Power Module Packaging Market , in the forecast period.

Chapter 3, studies the competitive situation among the major manufacturers and vendors, with sales, revenue, and market share.

Chapter 4, analyzes the global market by regions, with sales, revenue, and market share of Power Module Packaging Market, for each region, from 2020 to 2032.

Chapters 5, 6, 7, 8 and 9, analyze the Power Module Packaging Market  by type, application, regions, and manufacturers, with sales, revenue, and market share by key countries in these regions…Continued

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About Emergen Research

Emergen Research is a Market research and consulting company that provides syndicated research reports, customized research reports, and consulting services. Our solutions purely focus on your purpose to locate, target, and analyze consumer behavior shifts across demographics, across industries, and help clients make smarter business decisions. We offer Market intelligence studies ensuring relevant and fact-based research across multiple industries, including Healthcare, Touch Points, Chemicals, Types, and Energy. We consistently update our research offerings to ensure our clients are aware of the latest trends existent in the market. Emergen Research has a strong base of experienced analysts from varied areas of expertise. Our industry experience and ability to develop a concrete solution to any research problems provides our clients with the ability to secure an edge over their respective competitors. 

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